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CreatBot industrial 3D printers are designed for high-performance materials. The following models feature heated chambers and high-temperature nozzles for professional-grade results.
| Drying Conditions Before Printing | |
|---|---|
| Drying Temperature and Time | 100-120℃,6-8 H |
| Printing Parameters | |
|---|---|
| Nozzle Temperature | 400-450℃ |
| Nozzle Diameter | 0.4 / 0.6 / 0.8 / 1.0 mm |
| Print Bed Surface Treatment | 3D Print Spray / PVP Solid Glue / Special Adhesive |
| Print Bed Temperature | 110-220℃ |
| Chamber Temperature | 40-60/90-200℃ |
| Cooling Fan | 0-100% |
| Print Speed | 30-60 mm/s |
| Physical Properties | Test Method | Data |
|---|---|---|
| Density | ISO1183 | 1.28g/cm³ |
| Saturation Water Absorption | 25℃,55%RH | / |
| Melt Flow Rate | ISO 1133 | 16g/10min |
| Melt Temperature | ISO 11357 | 340℃ |
| Vicat Softening Temperature | ISO 306,GB/T 1633 | / |
| Heat Deflection Temperature | ISO 75,0.45MPa | 150℃ |
| Mechanical Properties | Test Method | Data |
|---|---|---|
| Tensile Strength XY | ISO 527, GB/T 1040 | 75 MPa |
| Tensile Strength Z | ISO 527, GB/T 1040 | / |
| Young's Modulus XY | ISO 527, GB/T 1040 | 4400 MPa |
| Young's Modulus Z | ISO 527, GB/T 1040 | / |
| Elongation at Break XY | ISO 527, GB/T 1040 | 5.0% |
| Elongation at Break Z | ISO 527, GB/T 1040 | / |
| Flexural Strength XY | ISO 178, GB/T 9341 | 115 MPa |
| Flexural Strength Z | ISO 178, GB/T 9341 | / |
| Flexural Modulus XY | ISO 178, GB/T 9341 | 2500 MPa |
| Flexural Modulus Z | ISO 178, GB/T 9341 | / |
| Impact Strength XY | ISO 179, GB/T 1043 | 65 kJ/m² |
| Impact Strength Z | ISO 179, GB/T 1043 | / |
PEI 9085 material requires high temperature and specialized equipment for printing. Recommended nozzle temperature is 400-450°C, print bed temperature 110-220°C, chamber temperature 40-60/90-200°C. Before printing, dry in a forced-air drying oven at 100-120°C for 6-8 hours. Cooling fan 0-100%. Must use specialized high-temperature 3D printers such as CreatBot PEEK-250/PEEK-300 and other high-temperature series printers.
PEI 9085 has higher impact strength (65 kJ/m² vs lower values for PEEK) while maintaining good mechanical properties. The printing temperature range of PEI 9085 is similar to PEEK, but with better processability and lower cost.
PEI 9085 material has strong moisture absorption. Moisture vaporizes during high-temperature printing, causing bubbles inside the print and silver streaks on the surface, severely affecting mechanical properties and appearance quality. Drying in a forced-air drying oven at 100-120°C for 6-8 hours can effectively remove moisture from the material.
With its excellent comprehensive properties, PEI 9085 has wide applications in multiple high-end fields. Typical applications include: ① Aerospace—engine peripheral parts, structural brackets, heat shields, etc.; ② Medical devices—artificial bones, surgical instruments, implants, etc.; ③ Automotive manufacturing—engine parts, bearings, seals, etc.; ④ Electronics & Electrical—chip carriers, connectors, etc., with excellent electrical insulation properties; ⑤ Precision machinery—high-rigid structural components, tooling fixtures, etc.
PEI 9085 material has strong moisture absorption, and proper storage is crucial for ensuring print quality. Storage methods: ① Unopened filament should be stored in a cool, dry place (temperature 15-25°C, humidity <30%), avoiding direct sunlight; ② Opened filament is recommended to be sealed with desiccant in a sealed bag; ③ For short-term non-use (more than 24 hours), it is recommended to remove the filament from the printer and store it sealed.
First-layer adhesion is key to successful PEI 9085 printing. The following measures are recommended: ① Heat the print bed to 110-220°C and maintain stable temperature; ② Use 3D print spray, PVP solid glue, or special adhesive to treat the bed surface; ③ Reduce first-layer print speed to 15-20mm/s, with nozzle height slightly lower than normal settings; ④ Set first-layer line width to 120-150% of nozzle diameter to increase contact area; ⑤ Use brim with a width of 8-12mm.